燙金基本工藝是在(zai)壓力狀(zhuang)態(tai)，即電(dian)化(hua)(hua)(hua)鋁(lv)被燙印版、承印物(wu)壓住的狀(zhuang)態(tai)下，電(dian)化(hua)(hua)(hua)鋁(lv)受(shou)熱(re)(re)使其上熱(re)(re)熔(rong)(rong)性的有機(ji)硅(gui)樹脂層和膠(jiao)(jiao)牯劑熔(rong)(rong)化(hua)(hua)(hua)，此時受(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)(hua)的有機(ji)硅(gui)樹脂粘(zhan)性變小，而特種熱(re)(re)敏膠(jiao)(jiao)粘(zhan)劑受(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)(hua)后粘(zhan)性增加(jia)，使得鋁(lv)層與電(dian)化(hua)(hua)(hua)鋁(lv)基膜(mo)剝離的同時轉(zhuan)印到了承印物(wu)上。隨著壓力的卸(xie)除，膠(jiao)(jiao)粘(zhan)劑迅速(su)冷卻固化(hua)(hua)(hua)，鋁(lv)層牢固地附著在(zai)承印物(wu)上，完成一(yi)個燙印過程(cheng)。