燙金(jin)基(ji)本工藝是在(zai)壓(ya)力(li)狀態，即電(dian)(dian)化(hua)(hua)鋁被燙印(yin)版、承(cheng)印(yin)物(wu)壓(ya)住的(de)狀態下，電(dian)(dian)化(hua)(hua)鋁受熱(re)使(shi)(shi)其上熱(re)熔(rong)(rong)性(xing)的(de)有(you)機硅樹(shu)脂層(ceng)和膠牯劑(ji)熔(rong)(rong)化(hua)(hua)，此(ci)時受熱(re)熔(rong)(rong)化(hua)(hua)的(de)有(you)機硅樹(shu)脂粘(zhan)性(xing)變(bian)小，而特(te)種熱(re)敏膠粘(zhan)劑(ji)受熱(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)性(xing)增加，使(shi)(shi)得鋁層(ceng)與(yu)電(dian)(dian)化(hua)(hua)鋁基(ji)膜剝離(li)的(de)同時轉印(yin)到了承(cheng)印(yin)物(wu)上。隨著(zhu)壓(ya)力(li)的(de)卸除，膠粘(zhan)劑(ji)迅速冷卻固化(hua)(hua)，鋁層(ceng)牢固地附著(zhu)在(zai)承(cheng)印(yin)物(wu)上，完成一個燙印(yin)過程(cheng)。