燙(tang)金基(ji)本工藝(yi)是(shi)在壓(ya)(ya)力狀(zhuang)態，即電(dian)化(hua)鋁(lv)(lv)被燙(tang)印(yin)版、承印(yin)物(wu)(wu)壓(ya)(ya)住的(de)狀(zhuang)態下，電(dian)化(hua)鋁(lv)(lv)受熱(re)(re)(re)使(shi)其上(shang)熱(re)(re)(re)熔(rong)(rong)性(xing)的(de)有機硅樹脂層和(he)膠(jiao)牯劑熔(rong)(rong)化(hua)，此時受熱(re)(re)(re)熔(rong)(rong)化(hua)的(de)有機硅樹脂粘(zhan)性(xing)變小，而特種(zhong)熱(re)(re)(re)敏膠(jiao)粘(zhan)劑受熱(re)(re)(re)熔(rong)(rong)化(hua)后粘(zhan)性(xing)增加，使(shi)得鋁(lv)(lv)層與電(dian)化(hua)鋁(lv)(lv)基(ji)膜(mo)剝離的(de)同時轉印(yin)到了承印(yin)物(wu)(wu)上(shang)。隨著(zhu)壓(ya)(ya)力的(de)卸(xie)除，膠(jiao)粘(zhan)劑迅速冷卻固(gu)化(hua)，鋁(lv)(lv)層牢固(gu)地附著(zhu)在承印(yin)物(wu)(wu)上(shang)，完成一個燙(tang)印(yin)過程。