燙(tang)金基(ji)本工藝是(shi)在壓力狀態，即電(dian)(dian)化(hua)鋁(lv)被燙(tang)印(yin)版、承(cheng)印(yin)物(wu)(wu)壓住的(de)(de)(de)狀態下(xia)，電(dian)(dian)化(hua)鋁(lv)受熱(re)(re)使(shi)其(qi)上(shang)熱(re)(re)熔性(xing)(xing)的(de)(de)(de)有機硅樹(shu)脂(zhi)層(ceng)和膠(jiao)(jiao)牯劑熔化(hua)，此時(shi)受熱(re)(re)熔化(hua)的(de)(de)(de)有機硅樹(shu)脂(zhi)粘(zhan)性(xing)(xing)變小，而特種(zhong)熱(re)(re)敏膠(jiao)(jiao)粘(zhan)劑受熱(re)(re)熔化(hua)后(hou)粘(zhan)性(xing)(xing)增加(jia)，使(shi)得鋁(lv)層(ceng)與(yu)電(dian)(dian)化(hua)鋁(lv)基(ji)膜(mo)剝離的(de)(de)(de)同時(shi)轉印(yin)到了承(cheng)印(yin)物(wu)(wu)上(shang)。隨著壓力的(de)(de)(de)卸除，膠(jiao)(jiao)粘(zhan)劑迅速冷卻固(gu)(gu)化(hua)，鋁(lv)層(ceng)牢固(gu)(gu)地(di)附著在承(cheng)印(yin)物(wu)(wu)上(shang)，完成一個燙(tang)印(yin)過(guo)程(cheng)。