燙(tang)金基本工藝是在壓力(li)狀(zhuang)態，即電(dian)(dian)化(hua)鋁(lv)被燙(tang)印(yin)版、承(cheng)(cheng)印(yin)物壓住的(de)狀(zhuang)態下(xia)，電(dian)(dian)化(hua)鋁(lv)受(shou)(shou)熱(re)使(shi)其(qi)上熱(re)熔(rong)性(xing)的(de)有(you)機硅樹脂層和膠牯劑熔(rong)化(hua)，此時受(shou)(shou)熱(re)熔(rong)化(hua)的(de)有(you)機硅樹脂粘(zhan)(zhan)性(xing)變小，而特種熱(re)敏膠粘(zhan)(zhan)劑受(shou)(shou)熱(re)熔(rong)化(hua)后粘(zhan)(zhan)性(xing)增加(jia)，使(shi)得鋁(lv)層與(yu)電(dian)(dian)化(hua)鋁(lv)基膜(mo)剝離的(de)同(tong)時轉(zhuan)印(yin)到了承(cheng)(cheng)印(yin)物上。隨著(zhu)壓力(li)的(de)卸除(chu)，膠粘(zhan)(zhan)劑迅速冷卻(que)固(gu)化(hua)，鋁(lv)層牢固(gu)地附著(zhu)在承(cheng)(cheng)印(yin)物上，完成一個(ge)燙(tang)印(yin)過程。