燙金基(ji)本工藝是在(zai)壓(ya)力狀態，即電化鋁(lv)被燙印版、承印物(wu)(wu)壓(ya)住的(de)(de)狀態下，電化鋁(lv)受(shou)(shou)熱(re)使(shi)其(qi)上(shang)熱(re)熔(rong)(rong)性(xing)的(de)(de)有機(ji)硅樹(shu)脂(zhi)(zhi)層和(he)膠牯劑(ji)熔(rong)(rong)化，此時受(shou)(shou)熱(re)熔(rong)(rong)化的(de)(de)有機(ji)硅樹(shu)脂(zhi)(zhi)粘(zhan)性(xing)變小，而特種熱(re)敏(min)膠粘(zhan)劑(ji)受(shou)(shou)熱(re)熔(rong)(rong)化后(hou)粘(zhan)性(xing)增加(jia)，使(shi)得鋁(lv)層與電化鋁(lv)基(ji)膜剝離(li)的(de)(de)同時轉印到了承印物(wu)(wu)上(shang)。隨(sui)著(zhu)壓(ya)力的(de)(de)卸(xie)除，膠粘(zhan)劑(ji)迅(xun)速冷卻固(gu)化，鋁(lv)層牢固(gu)地附著(zhu)在(zai)承印物(wu)(wu)上(shang)，完成一個燙印過(guo)程(cheng)。