燙(tang)金基(ji)本工藝是在壓(ya)力狀(zhuang)態(tai)，即電(dian)化(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)版、承印(yin)物壓(ya)住的狀(zhuang)態(tai)下，電(dian)化(hua)(hua)鋁(lv)(lv)受熱(re)使其上(shang)(shang)熱(re)熔性的有(you)機硅(gui)(gui)樹(shu)脂層(ceng)(ceng)和膠牯劑(ji)熔化(hua)(hua)，此時受熱(re)熔化(hua)(hua)的有(you)機硅(gui)(gui)樹(shu)脂粘(zhan)性變(bian)小(xiao)，而特種熱(re)敏(min)膠粘(zhan)劑(ji)受熱(re)熔化(hua)(hua)后粘(zhan)性增(zeng)加，使得鋁(lv)(lv)層(ceng)(ceng)與電(dian)化(hua)(hua)鋁(lv)(lv)基(ji)膜剝(bo)離(li)的同(tong)時轉印(yin)到(dao)了承印(yin)物上(shang)(shang)。隨著壓(ya)力的卸除(chu)，膠粘(zhan)劑(ji)迅速(su)冷卻固(gu)化(hua)(hua)，鋁(lv)(lv)層(ceng)(ceng)牢(lao)固(gu)地附著在承印(yin)物上(shang)(shang)，完(wan)成(cheng)一個燙(tang)印(yin)過(guo)程。