燙金基(ji)本工藝是在壓(ya)(ya)力狀(zhuang)(zhuang)態，即電化鋁(lv)被(bei)燙印(yin)版(ban)、承印(yin)物壓(ya)(ya)住的狀(zhuang)(zhuang)態下(xia)，電化鋁(lv)受熱(re)(re)使其上熱(re)(re)熔(rong)性(xing)的有(you)機(ji)硅(gui)(gui)樹脂(zhi)層和膠(jiao)牯劑(ji)熔(rong)化，此時(shi)受熱(re)(re)熔(rong)化的有(you)機(ji)硅(gui)(gui)樹脂(zhi)粘(zhan)(zhan)(zhan)(zhan)性(xing)變小，而特種熱(re)(re)敏膠(jiao)粘(zhan)(zhan)(zhan)(zhan)劑(ji)受熱(re)(re)熔(rong)化后粘(zhan)(zhan)(zhan)(zhan)性(xing)增加，使得鋁(lv)層與電化鋁(lv)基(ji)膜剝離的同時(shi)轉印(yin)到了承印(yin)物上。隨著壓(ya)(ya)力的卸除，膠(jiao)粘(zhan)(zhan)(zhan)(zhan)劑(ji)迅速冷卻固化，鋁(lv)層牢固地附著在承印(yin)物上，完成一個燙印(yin)過程。