燙(tang)金基本工藝(yi)是在(zai)(zai)壓力狀(zhuang)(zhuang)態(tai)(tai)，即電(dian)化(hua)(hua)鋁被燙(tang)印(yin)(yin)版、承印(yin)(yin)物(wu)壓住的(de)狀(zhuang)(zhuang)態(tai)(tai)下，電(dian)化(hua)(hua)鋁受(shou)熱(re)使其上(shang)熱(re)熔(rong)性(xing)(xing)的(de)有機(ji)硅(gui)樹(shu)脂(zhi)層(ceng)和膠牯劑(ji)熔(rong)化(hua)(hua)，此時(shi)受(shou)熱(re)熔(rong)化(hua)(hua)的(de)有機(ji)硅(gui)樹(shu)脂(zhi)粘(zhan)(zhan)性(xing)(xing)變小，而特(te)種(zhong)熱(re)敏膠粘(zhan)(zhan)劑(ji)受(shou)熱(re)熔(rong)化(hua)(hua)后(hou)粘(zhan)(zhan)性(xing)(xing)增加，使得鋁層(ceng)與電(dian)化(hua)(hua)鋁基膜(mo)剝離(li)的(de)同(tong)時(shi)轉印(yin)(yin)到了(le)承印(yin)(yin)物(wu)上(shang)。隨著壓力的(de)卸(xie)除(chu)，膠粘(zhan)(zhan)劑(ji)迅速冷卻固(gu)化(hua)(hua)，鋁層(ceng)牢固(gu)地附著在(zai)(zai)承印(yin)(yin)物(wu)上(shang)，完成(cheng)一個燙(tang)印(yin)(yin)過(guo)程。