燙(tang)金基本(ben)工藝是在壓(ya)力狀態，即電化(hua)鋁(lv)(lv)被(bei)燙(tang)印(yin)版、承(cheng)(cheng)印(yin)物(wu)(wu)壓(ya)住的(de)狀態下，電化(hua)鋁(lv)(lv)受熱使其上熱熔(rong)(rong)性的(de)有機硅樹脂層和膠(jiao)(jiao)牯劑熔(rong)(rong)化(hua)，此(ci)時(shi)受熱熔(rong)(rong)化(hua)的(de)有機硅樹脂粘(zhan)性變小，而特種(zhong)熱敏膠(jiao)(jiao)粘(zhan)劑受熱熔(rong)(rong)化(hua)后粘(zhan)性增加，使得鋁(lv)(lv)層與電化(hua)鋁(lv)(lv)基膜剝(bo)離(li)的(de)同時(shi)轉(zhuan)印(yin)到了承(cheng)(cheng)印(yin)物(wu)(wu)上。隨著(zhu)(zhu)壓(ya)力的(de)卸除，膠(jiao)(jiao)粘(zhan)劑迅(xun)速冷卻固(gu)化(hua)，鋁(lv)(lv)層牢固(gu)地附著(zhu)(zhu)在承(cheng)(cheng)印(yin)物(wu)(wu)上，完(wan)成一個燙(tang)印(yin)過程。