燙金基本工藝是在壓(ya)(ya)力(li)狀態(tai)，即(ji)電(dian)(dian)化(hua)(hua)(hua)(hua)鋁(lv)被(bei)燙印(yin)版(ban)、承印(yin)物(wu)壓(ya)(ya)住的(de)狀態(tai)下，電(dian)(dian)化(hua)(hua)(hua)(hua)鋁(lv)受熱(re)使其上熱(re)熔(rong)(rong)(rong)性(xing)(xing)的(de)有機硅樹脂層(ceng)和膠牯劑熔(rong)(rong)(rong)化(hua)(hua)(hua)(hua)，此時受熱(re)熔(rong)(rong)(rong)化(hua)(hua)(hua)(hua)的(de)有機硅樹脂粘(zhan)性(xing)(xing)變小，而特種熱(re)敏(min)膠粘(zhan)劑受熱(re)熔(rong)(rong)(rong)化(hua)(hua)(hua)(hua)后粘(zhan)性(xing)(xing)增加，使得(de)鋁(lv)層(ceng)與電(dian)(dian)化(hua)(hua)(hua)(hua)鋁(lv)基膜(mo)剝離的(de)同時轉印(yin)到了承印(yin)物(wu)上。隨著(zhu)壓(ya)(ya)力(li)的(de)卸除，膠粘(zhan)劑迅速冷卻固化(hua)(hua)(hua)(hua)，鋁(lv)層(ceng)牢(lao)固地附(fu)著(zhu)在承印(yin)物(wu)上，完成一個(ge)燙印(yin)過(guo)程。