燙金(jin)基(ji)本(ben)工藝是(shi)在壓力(li)狀態(tai)，即電(dian)化(hua)鋁被燙印(yin)版、承(cheng)印(yin)物壓住的狀態(tai)下，電(dian)化(hua)鋁受(shou)(shou)(shou)熱(re)使其(qi)上(shang)熱(re)熔(rong)性(xing)的有機硅(gui)樹脂(zhi)層(ceng)和膠牯(gu)劑(ji)熔(rong)化(hua)，此時受(shou)(shou)(shou)熱(re)熔(rong)化(hua)的有機硅(gui)樹脂(zhi)粘(zhan)(zhan)性(xing)變(bian)小，而特種(zhong)熱(re)敏膠粘(zhan)(zhan)劑(ji)受(shou)(shou)(shou)熱(re)熔(rong)化(hua)后粘(zhan)(zhan)性(xing)增(zeng)加，使得鋁層(ceng)與電(dian)化(hua)鋁基(ji)膜剝離的同(tong)時轉印(yin)到(dao)了承(cheng)印(yin)物上(shang)。隨著壓力(li)的卸(xie)除，膠粘(zhan)(zhan)劑(ji)迅(xun)速冷(leng)卻固化(hua)，鋁層(ceng)牢(lao)固地附著在承(cheng)印(yin)物上(shang)，完成(cheng)一個燙印(yin)過程。