燙(tang)金基本工藝(yi)是在(zai)壓力狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)(yin)版、承(cheng)(cheng)印(yin)(yin)物壓住的(de)狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)受熱使其上熱熔(rong)性(xing)的(de)有(you)機硅樹脂層(ceng)和膠(jiao)牯劑(ji)熔(rong)化(hua)(hua)(hua)，此時受熱熔(rong)化(hua)(hua)(hua)的(de)有(you)機硅樹脂粘(zhan)性(xing)變小，而特種(zhong)熱敏膠(jiao)粘(zhan)劑(ji)受熱熔(rong)化(hua)(hua)(hua)后粘(zhan)性(xing)增加，使得鋁(lv)(lv)層(ceng)與電(dian)化(hua)(hua)(hua)鋁(lv)(lv)基膜剝離的(de)同時轉印(yin)(yin)到了(le)承(cheng)(cheng)印(yin)(yin)物上。隨著(zhu)壓力的(de)卸除，膠(jiao)粘(zhan)劑(ji)迅速冷(leng)卻固(gu)化(hua)(hua)(hua)，鋁(lv)(lv)層(ceng)牢固(gu)地(di)附著(zhu)在(zai)承(cheng)(cheng)印(yin)(yin)物上，完成一個燙(tang)印(yin)(yin)過(guo)程。