燙(tang)金基(ji)本工藝是在壓力狀態，即(ji)電(dian)(dian)化鋁被燙(tang)印(yin)(yin)(yin)版、承印(yin)(yin)(yin)物壓住(zhu)的(de)狀態下，電(dian)(dian)化鋁受(shou)熱(re)(re)使(shi)其上(shang)熱(re)(re)熔(rong)(rong)(rong)性的(de)有機硅樹(shu)脂層(ceng)和膠(jiao)牯(gu)劑(ji)(ji)熔(rong)(rong)(rong)化，此時受(shou)熱(re)(re)熔(rong)(rong)(rong)化的(de)有機硅樹(shu)脂粘(zhan)(zhan)性變(bian)小，而特(te)種(zhong)熱(re)(re)敏(min)膠(jiao)粘(zhan)(zhan)劑(ji)(ji)受(shou)熱(re)(re)熔(rong)(rong)(rong)化后粘(zhan)(zhan)性增加(jia)，使(shi)得鋁層(ceng)與電(dian)(dian)化鋁基(ji)膜剝離(li)的(de)同時轉印(yin)(yin)(yin)到(dao)了承印(yin)(yin)(yin)物上(shang)。隨著壓力的(de)卸除(chu)，膠(jiao)粘(zhan)(zhan)劑(ji)(ji)迅速冷卻固(gu)化，鋁層(ceng)牢固(gu)地附著在承印(yin)(yin)(yin)物上(shang)，完成一(yi)個燙(tang)印(yin)(yin)(yin)過程(cheng)。