燙金基(ji)本(ben)工藝(yi)是在(zai)壓(ya)力(li)(li)狀(zhuang)態，即(ji)電(dian)化(hua)鋁(lv)(lv)被燙印(yin)(yin)(yin)版(ban)、承印(yin)(yin)(yin)物(wu)(wu)壓(ya)住的(de)狀(zhuang)態下，電(dian)化(hua)鋁(lv)(lv)受(shou)熱使其上熱熔(rong)(rong)(rong)性(xing)的(de)有機硅樹脂(zhi)(zhi)層(ceng)和膠(jiao)牯劑熔(rong)(rong)(rong)化(hua)，此時受(shou)熱熔(rong)(rong)(rong)化(hua)的(de)有機硅樹脂(zhi)(zhi)粘性(xing)變小(xiao)，而特種熱敏膠(jiao)粘劑受(shou)熱熔(rong)(rong)(rong)化(hua)后粘性(xing)增加，使得鋁(lv)(lv)層(ceng)與電(dian)化(hua)鋁(lv)(lv)基(ji)膜剝離的(de)同(tong)時轉印(yin)(yin)(yin)到(dao)了承印(yin)(yin)(yin)物(wu)(wu)上。隨(sui)著(zhu)壓(ya)力(li)(li)的(de)卸除，膠(jiao)粘劑迅(xun)速冷(leng)卻固(gu)(gu)化(hua)，鋁(lv)(lv)層(ceng)牢固(gu)(gu)地附著(zhu)在(zai)承印(yin)(yin)(yin)物(wu)(wu)上，完成(cheng)一個燙印(yin)(yin)(yin)過程。