燙(tang)金基(ji)(ji)本工藝(yi)是在壓(ya)力(li)狀態，即電(dian)(dian)化(hua)(hua)鋁(lv)被燙(tang)印版、承(cheng)印物壓(ya)住(zhu)的(de)狀態下(xia)，電(dian)(dian)化(hua)(hua)鋁(lv)受熱使其上(shang)熱熔(rong)性的(de)有(you)(you)機硅樹(shu)脂(zhi)(zhi)層和膠牯劑熔(rong)化(hua)(hua)，此時(shi)受熱熔(rong)化(hua)(hua)的(de)有(you)(you)機硅樹(shu)脂(zhi)(zhi)粘(zhan)性變(bian)小，而(er)特種熱敏膠粘(zhan)劑受熱熔(rong)化(hua)(hua)后(hou)粘(zhan)性增加，使得鋁(lv)層與電(dian)(dian)化(hua)(hua)鋁(lv)基(ji)(ji)膜剝離的(de)同時(shi)轉(zhuan)印到了承(cheng)印物上(shang)。隨著壓(ya)力(li)的(de)卸除，膠粘(zhan)劑迅速冷(leng)卻固化(hua)(hua)，鋁(lv)層牢(lao)固地附著在承(cheng)印物上(shang)，完(wan)成一個燙(tang)印過程(cheng)。