燙金基(ji)本工藝是在壓力(li)狀(zhuang)態，即電(dian)化(hua)(hua)(hua)鋁(lv)被燙印版、承印物(wu)壓住的狀(zhuang)態下(xia)，電(dian)化(hua)(hua)(hua)鋁(lv)受熱(re)使(shi)其上(shang)熱(re)熔(rong)(rong)性(xing)的有機(ji)硅樹(shu)脂層(ceng)(ceng)和膠(jiao)牯劑(ji)熔(rong)(rong)化(hua)(hua)(hua)，此時(shi)受熱(re)熔(rong)(rong)化(hua)(hua)(hua)的有機(ji)硅樹(shu)脂粘(zhan)性(xing)變小，而特種熱(re)敏膠(jiao)粘(zhan)劑(ji)受熱(re)熔(rong)(rong)化(hua)(hua)(hua)后(hou)粘(zhan)性(xing)增加，使(shi)得(de)鋁(lv)層(ceng)(ceng)與(yu)電(dian)化(hua)(hua)(hua)鋁(lv)基(ji)膜剝離的同時(shi)轉印到了承印物(wu)上(shang)。隨(sui)著(zhu)壓力(li)的卸除，膠(jiao)粘(zhan)劑(ji)迅速冷卻固化(hua)(hua)(hua)，鋁(lv)層(ceng)(ceng)牢固地附著(zhu)在承印物(wu)上(shang)，完(wan)成一個燙印過程。