燙(tang)金基本工藝是在壓(ya)力狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)被燙(tang)印(yin)版、承印(yin)物壓(ya)住的(de)(de)狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)受熱(re)使(shi)其上(shang)熱(re)熔(rong)(rong)性的(de)(de)有(you)機(ji)硅樹脂層和膠牯劑(ji)熔(rong)(rong)化(hua)(hua)(hua)，此時受熱(re)熔(rong)(rong)化(hua)(hua)(hua)的(de)(de)有(you)機(ji)硅樹脂粘性變小(xiao)，而特種(zhong)熱(re)敏膠粘劑(ji)受熱(re)熔(rong)(rong)化(hua)(hua)(hua)后粘性增(zeng)加，使(shi)得鋁(lv)層與電(dian)化(hua)(hua)(hua)鋁(lv)基膜剝離的(de)(de)同時轉印(yin)到了(le)承印(yin)物上(shang)。隨著(zhu)(zhu)壓(ya)力的(de)(de)卸除，膠粘劑(ji)迅速冷(leng)卻固(gu)化(hua)(hua)(hua)，鋁(lv)層牢固(gu)地(di)附著(zhu)(zhu)在承印(yin)物上(shang)，完成(cheng)一個燙(tang)印(yin)過(guo)程。