燙(tang)(tang)金基本工藝是在壓力狀態，即電(dian)(dian)化(hua)(hua)鋁(lv)(lv)(lv)被燙(tang)(tang)印(yin)(yin)(yin)版、承印(yin)(yin)(yin)物(wu)壓住的狀態下(xia)，電(dian)(dian)化(hua)(hua)鋁(lv)(lv)(lv)受熱(re)使(shi)其上(shang)熱(re)熔(rong)性的有機硅(gui)樹脂層和膠(jiao)(jiao)牯劑熔(rong)化(hua)(hua)，此時受熱(re)熔(rong)化(hua)(hua)的有機硅(gui)樹脂粘(zhan)性變小，而特種(zhong)熱(re)敏膠(jiao)(jiao)粘(zhan)劑受熱(re)熔(rong)化(hua)(hua)后粘(zhan)性增(zeng)加，使(shi)得(de)鋁(lv)(lv)(lv)層與電(dian)(dian)化(hua)(hua)鋁(lv)(lv)(lv)基膜剝離的同時轉印(yin)(yin)(yin)到了承印(yin)(yin)(yin)物(wu)上(shang)。隨著(zhu)壓力的卸除，膠(jiao)(jiao)粘(zhan)劑迅(xun)速(su)冷卻固(gu)(gu)化(hua)(hua)，鋁(lv)(lv)(lv)層牢固(gu)(gu)地附著(zhu)在承印(yin)(yin)(yin)物(wu)上(shang)，完成一個燙(tang)(tang)印(yin)(yin)(yin)過程。