燙(tang)金基(ji)本工藝(yi)是在壓力狀(zhuang)態，即電(dian)(dian)化(hua)鋁(lv)(lv)被(bei)燙(tang)印(yin)版、承印(yin)物(wu)(wu)壓住的(de)(de)狀(zhuang)態下，電(dian)(dian)化(hua)鋁(lv)(lv)受(shou)(shou)熱(re)(re)使(shi)其上(shang)熱(re)(re)熔性(xing)(xing)的(de)(de)有機硅樹脂(zhi)層(ceng)和膠牯(gu)劑熔化(hua)，此時受(shou)(shou)熱(re)(re)熔化(hua)的(de)(de)有機硅樹脂(zhi)粘(zhan)性(xing)(xing)變小，而特種熱(re)(re)敏膠粘(zhan)劑受(shou)(shou)熱(re)(re)熔化(hua)后粘(zhan)性(xing)(xing)增加，使(shi)得鋁(lv)(lv)層(ceng)與電(dian)(dian)化(hua)鋁(lv)(lv)基(ji)膜剝離的(de)(de)同(tong)時轉印(yin)到了承印(yin)物(wu)(wu)上(shang)。隨著(zhu)(zhu)壓力的(de)(de)卸除，膠粘(zhan)劑迅(xun)速冷卻固(gu)化(hua)，鋁(lv)(lv)層(ceng)牢固(gu)地附著(zhu)(zhu)在承印(yin)物(wu)(wu)上(shang)，完成一個燙(tang)印(yin)過程。