燙(tang)金基本工藝(yi)是在壓力(li)狀態，即電(dian)(dian)化(hua)(hua)鋁(lv)被燙(tang)印版、承印物壓住(zhu)的(de)(de)狀態下，電(dian)(dian)化(hua)(hua)鋁(lv)受熱(re)使其上(shang)熱(re)熔(rong)性的(de)(de)有(you)機硅樹脂層和膠(jiao)(jiao)牯(gu)劑熔(rong)化(hua)(hua)，此時(shi)受熱(re)熔(rong)化(hua)(hua)的(de)(de)有(you)機硅樹脂粘(zhan)性變小(xiao)，而特種熱(re)敏膠(jiao)(jiao)粘(zhan)劑受熱(re)熔(rong)化(hua)(hua)后粘(zhan)性增加，使得鋁(lv)層與電(dian)(dian)化(hua)(hua)鋁(lv)基膜(mo)剝(bo)離的(de)(de)同(tong)時(shi)轉印到了承印物上(shang)。隨著壓力(li)的(de)(de)卸除，膠(jiao)(jiao)粘(zhan)劑迅速冷(leng)卻固(gu)(gu)化(hua)(hua)，鋁(lv)層牢固(gu)(gu)地(di)附著在承印物上(shang)，完成一個燙(tang)印過程。