燙(tang)金(jin)基(ji)本工藝是在(zai)壓力(li)狀態，即電化(hua)鋁被燙(tang)印版(ban)、承印物壓住(zhu)的狀態下，電化(hua)鋁受(shou)熱(re)使其上(shang)熱(re)熔(rong)(rong)(rong)性(xing)的有(you)機硅樹(shu)脂(zhi)層和(he)膠牯(gu)劑熔(rong)(rong)(rong)化(hua)，此(ci)時受(shou)熱(re)熔(rong)(rong)(rong)化(hua)的有(you)機硅樹(shu)脂(zhi)粘(zhan)(zhan)性(xing)變(bian)小(xiao)，而特(te)種熱(re)敏(min)膠粘(zhan)(zhan)劑受(shou)熱(re)熔(rong)(rong)(rong)化(hua)后粘(zhan)(zhan)性(xing)增(zeng)加，使得鋁層與(yu)電化(hua)鋁基(ji)膜剝離的同時轉(zhuan)印到了承印物上(shang)。隨(sui)著壓力(li)的卸除，膠粘(zhan)(zhan)劑迅速冷卻固化(hua)，鋁層牢固地附著在(zai)承印物上(shang)，完(wan)成一個(ge)燙(tang)印過程。