燙(tang)(tang)金基本(ben)工藝是在(zai)壓(ya)(ya)力狀態，即電(dian)化(hua)(hua)鋁(lv)(lv)(lv)被燙(tang)(tang)印版、承印物壓(ya)(ya)住的(de)狀態下(xia)，電(dian)化(hua)(hua)鋁(lv)(lv)(lv)受熱使其上熱熔(rong)(rong)(rong)性(xing)(xing)的(de)有(you)(you)機硅樹脂層和膠牯劑(ji)熔(rong)(rong)(rong)化(hua)(hua)，此時受熱熔(rong)(rong)(rong)化(hua)(hua)的(de)有(you)(you)機硅樹脂粘(zhan)(zhan)性(xing)(xing)變小(xiao)，而特種熱敏膠粘(zhan)(zhan)劑(ji)受熱熔(rong)(rong)(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)(xing)增加，使得鋁(lv)(lv)(lv)層與電(dian)化(hua)(hua)鋁(lv)(lv)(lv)基膜(mo)剝離的(de)同(tong)時轉印到了承印物上。隨著壓(ya)(ya)力的(de)卸(xie)除，膠粘(zhan)(zhan)劑(ji)迅(xun)速冷卻(que)固化(hua)(hua)，鋁(lv)(lv)(lv)層牢固地附著在(zai)承印物上，完成一(yi)個燙(tang)(tang)印過程。