燙(tang)金(jin)基本工藝是在壓力(li)狀(zhuang)態，即電(dian)(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)被燙(tang)印(yin)(yin)版(ban)、承(cheng)印(yin)(yin)物(wu)壓住的狀(zhuang)態下，電(dian)(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)受(shou)(shou)熱(re)(re)使其上(shang)熱(re)(re)熔(rong)(rong)性(xing)的有機(ji)硅樹脂(zhi)層和膠牯劑熔(rong)(rong)化(hua)(hua)(hua)，此時(shi)受(shou)(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)(hua)的有機(ji)硅樹脂(zhi)粘(zhan)性(xing)變小，而特種熱(re)(re)敏膠粘(zhan)劑受(shou)(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)(hua)后粘(zhan)性(xing)增加，使得鋁(lv)(lv)(lv)層與電(dian)(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)基膜剝離的同時(shi)轉印(yin)(yin)到了承(cheng)印(yin)(yin)物(wu)上(shang)。隨著壓力(li)的卸(xie)除，膠粘(zhan)劑迅速冷卻固(gu)化(hua)(hua)(hua)，鋁(lv)(lv)(lv)層牢固(gu)地附著在承(cheng)印(yin)(yin)物(wu)上(shang)，完(wan)成一個燙(tang)印(yin)(yin)過程。