燙(tang)金基(ji)本工藝是在壓(ya)力狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)被燙(tang)印(yin)版、承印(yin)物(wu)壓(ya)住的(de)狀態(tai)下，電(dian)化(hua)(hua)鋁(lv)受熱(re)使其上(shang)熱(re)熔(rong)(rong)(rong)性(xing)(xing)的(de)有(you)機硅(gui)樹(shu)脂(zhi)層(ceng)和膠(jiao)牯劑(ji)熔(rong)(rong)(rong)化(hua)(hua)，此(ci)時受熱(re)熔(rong)(rong)(rong)化(hua)(hua)的(de)有(you)機硅(gui)樹(shu)脂(zhi)粘性(xing)(xing)變小(xiao)，而特(te)種熱(re)敏膠(jiao)粘劑(ji)受熱(re)熔(rong)(rong)(rong)化(hua)(hua)后粘性(xing)(xing)增加，使得鋁(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)基(ji)膜剝離的(de)同時轉印(yin)到了承印(yin)物(wu)上(shang)。隨著壓(ya)力的(de)卸除(chu)，膠(jiao)粘劑(ji)迅速(su)冷卻固(gu)化(hua)(hua)，鋁(lv)層(ceng)牢固(gu)地附(fu)著在承印(yin)物(wu)上(shang)，完成一(yi)個(ge)燙(tang)印(yin)過程。