燙(tang)金基本工藝是在(zai)壓力狀態(tai)，即電(dian)(dian)化(hua)鋁(lv)被燙(tang)印(yin)(yin)版、承印(yin)(yin)物壓住的狀態(tai)下，電(dian)(dian)化(hua)鋁(lv)受(shou)熱(re)(re)使(shi)其上熱(re)(re)熔(rong)(rong)性的有機(ji)硅(gui)樹脂層和(he)膠(jiao)(jiao)牯劑(ji)(ji)熔(rong)(rong)化(hua)，此(ci)時(shi)受(shou)熱(re)(re)熔(rong)(rong)化(hua)的有機(ji)硅(gui)樹脂粘性變小，而特種熱(re)(re)敏膠(jiao)(jiao)粘劑(ji)(ji)受(shou)熱(re)(re)熔(rong)(rong)化(hua)后粘性增(zeng)加，使(shi)得鋁(lv)層與電(dian)(dian)化(hua)鋁(lv)基膜剝離(li)的同(tong)時(shi)轉印(yin)(yin)到了(le)承印(yin)(yin)物上。隨著(zhu)壓力的卸除(chu)，膠(jiao)(jiao)粘劑(ji)(ji)迅速冷卻固化(hua)，鋁(lv)層牢固地附著(zhu)在(zai)承印(yin)(yin)物上，完成一(yi)個燙(tang)印(yin)(yin)過(guo)程。