燙(tang)(tang)金基(ji)(ji)本工藝是(shi)在壓力(li)狀態(tai)，即(ji)電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)被燙(tang)(tang)印(yin)(yin)版、承(cheng)印(yin)(yin)物(wu)壓住的狀態(tai)下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)受(shou)熱使其上熱熔性(xing)的有(you)機硅樹脂(zhi)層(ceng)(ceng)和膠(jiao)(jiao)牯劑(ji)熔化(hua)(hua)(hua)，此(ci)時受(shou)熱熔化(hua)(hua)(hua)的有(you)機硅樹脂(zhi)粘性(xing)變小，而特種熱敏膠(jiao)(jiao)粘劑(ji)受(shou)熱熔化(hua)(hua)(hua)后粘性(xing)增加，使得鋁(lv)(lv)(lv)層(ceng)(ceng)與電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)基(ji)(ji)膜剝離(li)的同時轉印(yin)(yin)到了承(cheng)印(yin)(yin)物(wu)上。隨著壓力(li)的卸(xie)除，膠(jiao)(jiao)粘劑(ji)迅速冷卻固(gu)化(hua)(hua)(hua)，鋁(lv)(lv)(lv)層(ceng)(ceng)牢(lao)固(gu)地(di)附著在承(cheng)印(yin)(yin)物(wu)上，完成一個(ge)燙(tang)(tang)印(yin)(yin)過程。