燙(tang)(tang)金基(ji)本工藝是在壓(ya)力狀態，即電(dian)(dian)化(hua)鋁(lv)被燙(tang)(tang)印(yin)(yin)(yin)版、承(cheng)印(yin)(yin)(yin)物(wu)壓(ya)住的(de)狀態下(xia)，電(dian)(dian)化(hua)鋁(lv)受熱使(shi)其上熱熔(rong)(rong)(rong)性的(de)有(you)機硅樹(shu)脂層和膠(jiao)牯劑熔(rong)(rong)(rong)化(hua)，此時(shi)受熱熔(rong)(rong)(rong)化(hua)的(de)有(you)機硅樹(shu)脂粘(zhan)(zhan)性變小，而特(te)種(zhong)熱敏膠(jiao)粘(zhan)(zhan)劑受熱熔(rong)(rong)(rong)化(hua)后粘(zhan)(zhan)性增加，使(shi)得鋁(lv)層與電(dian)(dian)化(hua)鋁(lv)基(ji)膜剝離的(de)同時(shi)轉印(yin)(yin)(yin)到了承(cheng)印(yin)(yin)(yin)物(wu)上。隨著(zhu)(zhu)壓(ya)力的(de)卸除(chu)，膠(jiao)粘(zhan)(zhan)劑迅速冷卻固化(hua)，鋁(lv)層牢固地附著(zhu)(zhu)在承(cheng)印(yin)(yin)(yin)物(wu)上，完成一個燙(tang)(tang)印(yin)(yin)(yin)過程。