燙(tang)金基(ji)本工藝是(shi)在壓力狀態(tai)，即電(dian)化(hua)(hua)(hua)(hua)鋁(lv)被燙(tang)印(yin)(yin)版(ban)、承(cheng)印(yin)(yin)物(wu)壓住的狀態(tai)下(xia)，電(dian)化(hua)(hua)(hua)(hua)鋁(lv)受(shou)熱使其(qi)上熱熔(rong)性的有機(ji)硅(gui)樹(shu)脂層(ceng)和(he)膠牯(gu)劑熔(rong)化(hua)(hua)(hua)(hua)，此時受(shou)熱熔(rong)化(hua)(hua)(hua)(hua)的有機(ji)硅(gui)樹(shu)脂粘(zhan)性變(bian)小，而(er)特種熱敏膠粘(zhan)劑受(shou)熱熔(rong)化(hua)(hua)(hua)(hua)后粘(zhan)性增加，使得鋁(lv)層(ceng)與電(dian)化(hua)(hua)(hua)(hua)鋁(lv)基(ji)膜剝離(li)的同(tong)時轉印(yin)(yin)到了承(cheng)印(yin)(yin)物(wu)上。隨著壓力的卸除，膠粘(zhan)劑迅(xun)速冷卻固化(hua)(hua)(hua)(hua)，鋁(lv)層(ceng)牢(lao)固地附著在承(cheng)印(yin)(yin)物(wu)上，完成(cheng)一個燙(tang)印(yin)(yin)過(guo)程。