燙金基本工藝是在壓力狀(zhuang)(zhuang)態(tai)(tai)，即電(dian)化(hua)(hua)鋁(lv)被燙印(yin)版(ban)、承(cheng)印(yin)物壓住的狀(zhuang)(zhuang)態(tai)(tai)下，電(dian)化(hua)(hua)鋁(lv)受熱(re)(re)使(shi)其上(shang)熱(re)(re)熔(rong)性的有機硅樹脂(zhi)層(ceng)和(he)膠牯劑熔(rong)化(hua)(hua)，此(ci)時受熱(re)(re)熔(rong)化(hua)(hua)的有機硅樹脂(zhi)粘(zhan)性變小，而特種(zhong)熱(re)(re)敏膠粘(zhan)劑受熱(re)(re)熔(rong)化(hua)(hua)后(hou)粘(zhan)性增加，使(shi)得鋁(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)基膜剝離的同時轉(zhuan)印(yin)到了承(cheng)印(yin)物上(shang)。隨著(zhu)壓力的卸(xie)除，膠粘(zhan)劑迅速冷卻(que)固化(hua)(hua)，鋁(lv)層(ceng)牢固地附著(zhu)在承(cheng)印(yin)物上(shang)，完成一個燙印(yin)過程。