燙(tang)金(jin)基(ji)本工藝是在(zai)壓(ya)(ya)力狀(zhuang)(zhuang)態，即電(dian)化(hua)(hua)(hua)鋁(lv)(lv)被(bei)燙(tang)印(yin)版、承(cheng)印(yin)物壓(ya)(ya)住的狀(zhuang)(zhuang)態下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)受(shou)(shou)熱(re)(re)使其上(shang)(shang)熱(re)(re)熔(rong)性的有機(ji)硅樹脂(zhi)層和(he)膠(jiao)(jiao)牯(gu)劑(ji)(ji)熔(rong)化(hua)(hua)(hua)，此時(shi)受(shou)(shou)熱(re)(re)熔(rong)化(hua)(hua)(hua)的有機(ji)硅樹脂(zhi)粘性變(bian)小，而特(te)種熱(re)(re)敏(min)膠(jiao)(jiao)粘劑(ji)(ji)受(shou)(shou)熱(re)(re)熔(rong)化(hua)(hua)(hua)后(hou)粘性增(zeng)加(jia)，使得鋁(lv)(lv)層與(yu)電(dian)化(hua)(hua)(hua)鋁(lv)(lv)基(ji)膜剝離的同時(shi)轉印(yin)到(dao)了承(cheng)印(yin)物上(shang)(shang)。隨著壓(ya)(ya)力的卸除(chu)，膠(jiao)(jiao)粘劑(ji)(ji)迅速冷卻固化(hua)(hua)(hua)，鋁(lv)(lv)層牢(lao)固地附著在(zai)承(cheng)印(yin)物上(shang)(shang)，完成一(yi)個燙(tang)印(yin)過程。