燙(tang)金基本工藝(yi)是(shi)在壓(ya)力狀態(tai)，即電(dian)化(hua)(hua)(hua)鋁被燙(tang)印(yin)(yin)版(ban)、承印(yin)(yin)物壓(ya)住的狀態(tai)下(xia)，電(dian)化(hua)(hua)(hua)鋁受熱(re)(re)使(shi)其(qi)上熱(re)(re)熔性(xing)的有機(ji)硅樹脂(zhi)層(ceng)和膠(jiao)(jiao)牯劑熔化(hua)(hua)(hua)，此時(shi)受熱(re)(re)熔化(hua)(hua)(hua)的有機(ji)硅樹脂(zhi)粘(zhan)(zhan)性(xing)變小(xiao)，而(er)特種(zhong)熱(re)(re)敏膠(jiao)(jiao)粘(zhan)(zhan)劑受熱(re)(re)熔化(hua)(hua)(hua)后(hou)粘(zhan)(zhan)性(xing)增加，使(shi)得鋁層(ceng)與電(dian)化(hua)(hua)(hua)鋁基膜剝(bo)離的同時(shi)轉(zhuan)印(yin)(yin)到(dao)了承印(yin)(yin)物上。隨著壓(ya)力的卸除，膠(jiao)(jiao)粘(zhan)(zhan)劑迅速冷(leng)卻固(gu)化(hua)(hua)(hua)，鋁層(ceng)牢固(gu)地(di)附著在承印(yin)(yin)物上，完成一個燙(tang)印(yin)(yin)過程。