燙金基本工藝是(shi)在壓(ya)(ya)(ya)力狀態(tai)，即電化(hua)鋁(lv)(lv)(lv)被燙印(yin)(yin)(yin)版(ban)、承(cheng)印(yin)(yin)(yin)物壓(ya)(ya)(ya)住的狀態(tai)下，電化(hua)鋁(lv)(lv)(lv)受熱(re)(re)(re)(re)使其上(shang)熱(re)(re)(re)(re)熔(rong)(rong)(rong)性(xing)的有機硅樹脂(zhi)層和膠牯劑(ji)熔(rong)(rong)(rong)化(hua)，此(ci)時受熱(re)(re)(re)(re)熔(rong)(rong)(rong)化(hua)的有機硅樹脂(zhi)粘性(xing)變小，而特種熱(re)(re)(re)(re)敏膠粘劑(ji)受熱(re)(re)(re)(re)熔(rong)(rong)(rong)化(hua)后(hou)粘性(xing)增加(jia)，使得(de)鋁(lv)(lv)(lv)層與電化(hua)鋁(lv)(lv)(lv)基膜剝(bo)離的同時轉印(yin)(yin)(yin)到了承(cheng)印(yin)(yin)(yin)物上(shang)。隨著(zhu)壓(ya)(ya)(ya)力的卸除(chu)，膠粘劑(ji)迅速冷卻固化(hua)，鋁(lv)(lv)(lv)層牢固地附著(zhu)在承(cheng)印(yin)(yin)(yin)物上(shang)，完成一個燙印(yin)(yin)(yin)過程(cheng)。