燙(tang)金基本工藝(yi)是在壓力狀態，即(ji)電(dian)(dian)(dian)化(hua)(hua)(hua)鋁(lv)被燙(tang)印(yin)版、承印(yin)物壓住的狀態下，電(dian)(dian)(dian)化(hua)(hua)(hua)鋁(lv)受(shou)熱(re)使其上(shang)熱(re)熔(rong)(rong)性的有機(ji)硅樹(shu)(shu)脂層和膠(jiao)(jiao)牯劑熔(rong)(rong)化(hua)(hua)(hua)，此時(shi)受(shou)熱(re)熔(rong)(rong)化(hua)(hua)(hua)的有機(ji)硅樹(shu)(shu)脂粘(zhan)性變小，而特種熱(re)敏膠(jiao)(jiao)粘(zhan)劑受(shou)熱(re)熔(rong)(rong)化(hua)(hua)(hua)后粘(zhan)性增加，使得鋁(lv)層與電(dian)(dian)(dian)化(hua)(hua)(hua)鋁(lv)基膜剝離的同(tong)時(shi)轉印(yin)到了(le)承印(yin)物上(shang)。隨著(zhu)壓力的卸除，膠(jiao)(jiao)粘(zhan)劑迅速冷卻固化(hua)(hua)(hua)，鋁(lv)層牢固地附(fu)著(zhu)在承印(yin)物上(shang)，完成一個燙(tang)印(yin)過程(cheng)。