燙金基(ji)本工藝是在壓力(li)狀態(tai)，即電(dian)化(hua)(hua)鋁被燙印(yin)版、承(cheng)印(yin)物(wu)壓住的(de)(de)狀態(tai)下，電(dian)化(hua)(hua)鋁受熱(re)使其上熱(re)熔(rong)(rong)(rong)性的(de)(de)有機硅樹(shu)脂(zhi)層和膠(jiao)牯劑熔(rong)(rong)(rong)化(hua)(hua)，此時受熱(re)熔(rong)(rong)(rong)化(hua)(hua)的(de)(de)有機硅樹(shu)脂(zhi)粘(zhan)性變小(xiao)，而特種熱(re)敏膠(jiao)粘(zhan)劑受熱(re)熔(rong)(rong)(rong)化(hua)(hua)后(hou)粘(zhan)性增加，使得鋁層與電(dian)化(hua)(hua)鋁基(ji)膜(mo)剝離的(de)(de)同時轉(zhuan)印(yin)到了承(cheng)印(yin)物(wu)上。隨著(zhu)(zhu)壓力(li)的(de)(de)卸除，膠(jiao)粘(zhan)劑迅速冷(leng)卻固化(hua)(hua)，鋁層牢(lao)固地附著(zhu)(zhu)在承(cheng)印(yin)物(wu)上，完成(cheng)一個燙印(yin)過程。