燙(tang)金基本工藝是在壓(ya)(ya)力狀態(tai)，即(ji)電(dian)(dian)化(hua)(hua)鋁(lv)被燙(tang)印(yin)版、承印(yin)物壓(ya)(ya)住的(de)(de)狀態(tai)下，電(dian)(dian)化(hua)(hua)鋁(lv)受(shou)熱使(shi)其上熱熔(rong)性的(de)(de)有(you)機硅樹(shu)脂(zhi)層(ceng)和膠牯劑熔(rong)化(hua)(hua)，此時(shi)受(shou)熱熔(rong)化(hua)(hua)的(de)(de)有(you)機硅樹(shu)脂(zhi)粘(zhan)性變(bian)小，而特種熱敏(min)膠粘(zhan)劑受(shou)熱熔(rong)化(hua)(hua)后粘(zhan)性增加，使(shi)得鋁(lv)層(ceng)與電(dian)(dian)化(hua)(hua)鋁(lv)基膜剝(bo)離的(de)(de)同時(shi)轉印(yin)到了承印(yin)物上。隨著壓(ya)(ya)力的(de)(de)卸除，膠粘(zhan)劑迅速冷卻固化(hua)(hua)，鋁(lv)層(ceng)牢固地(di)附著在承印(yin)物上，完(wan)成一個燙(tang)印(yin)過(guo)程(cheng)。