燙(tang)金(jin)基(ji)本工藝是在壓(ya)力狀(zhuang)態，即電化(hua)(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)版、承印(yin)物(wu)壓(ya)住的狀(zhuang)態下，電化(hua)(hua)(hua)鋁(lv)(lv)受(shou)熱(re)使(shi)其上(shang)熱(re)熔(rong)(rong)性的有機(ji)硅樹(shu)(shu)脂(zhi)層和膠牯劑(ji)熔(rong)(rong)化(hua)(hua)(hua)，此時受(shou)熱(re)熔(rong)(rong)化(hua)(hua)(hua)的有機(ji)硅樹(shu)(shu)脂(zhi)粘(zhan)性變(bian)小，而特種熱(re)敏膠粘(zhan)劑(ji)受(shou)熱(re)熔(rong)(rong)化(hua)(hua)(hua)后粘(zhan)性增加，使(shi)得鋁(lv)(lv)層與(yu)電化(hua)(hua)(hua)鋁(lv)(lv)基(ji)膜剝離的同時轉(zhuan)印(yin)到了(le)承印(yin)物(wu)上(shang)。隨著壓(ya)力的卸(xie)除，膠粘(zhan)劑(ji)迅速冷卻固化(hua)(hua)(hua)，鋁(lv)(lv)層牢(lao)固地附著在承印(yin)物(wu)上(shang)，完(wan)成一個燙(tang)印(yin)過程(cheng)。