燙金基(ji)(ji)本工藝是在壓(ya)力(li)狀態(tai)，即電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)被燙印(yin)版、承印(yin)物壓(ya)住的(de)(de)狀態(tai)下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)受(shou)(shou)熱(re)使(shi)其上熱(re)熔(rong)性(xing)的(de)(de)有機(ji)硅(gui)樹(shu)脂(zhi)層和膠(jiao)牯劑熔(rong)化(hua)(hua)(hua)，此時(shi)受(shou)(shou)熱(re)熔(rong)化(hua)(hua)(hua)的(de)(de)有機(ji)硅(gui)樹(shu)脂(zhi)粘(zhan)性(xing)變(bian)小，而(er)特種熱(re)敏(min)膠(jiao)粘(zhan)劑受(shou)(shou)熱(re)熔(rong)化(hua)(hua)(hua)后(hou)粘(zhan)性(xing)增加(jia)，使(shi)得鋁(lv)(lv)(lv)層與(yu)電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)基(ji)(ji)膜剝(bo)離的(de)(de)同時(shi)轉印(yin)到(dao)了承印(yin)物上。隨著壓(ya)力(li)的(de)(de)卸除(chu)，膠(jiao)粘(zhan)劑迅速(su)冷卻(que)固(gu)化(hua)(hua)(hua)，鋁(lv)(lv)(lv)層牢固(gu)地(di)附著在承印(yin)物上，完成一個燙印(yin)過程。