燙(tang)金基本(ben)工藝是在(zai)壓力狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)被燙(tang)印(yin)版(ban)、承(cheng)印(yin)物(wu)壓住(zhu)的(de)(de)狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)受熱使其上熱熔(rong)性(xing)(xing)的(de)(de)有(you)機(ji)硅樹脂(zhi)層和膠(jiao)(jiao)牯劑(ji)熔(rong)化(hua)(hua)(hua)，此時受熱熔(rong)化(hua)(hua)(hua)的(de)(de)有(you)機(ji)硅樹脂(zhi)粘(zhan)性(xing)(xing)變(bian)小，而特種熱敏膠(jiao)(jiao)粘(zhan)劑(ji)受熱熔(rong)化(hua)(hua)(hua)后粘(zhan)性(xing)(xing)增加，使得鋁(lv)層與電(dian)化(hua)(hua)(hua)鋁(lv)基膜剝離的(de)(de)同時轉印(yin)到了承(cheng)印(yin)物(wu)上。隨著壓力的(de)(de)卸除，膠(jiao)(jiao)粘(zhan)劑(ji)迅速冷卻固(gu)化(hua)(hua)(hua)，鋁(lv)層牢(lao)固(gu)地附著在(zai)承(cheng)印(yin)物(wu)上，完(wan)成一個燙(tang)印(yin)過程。