燙(tang)金基本(ben)工藝是在(zai)壓(ya)力狀(zhuang)態，即電化(hua)(hua)(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)版、承(cheng)印(yin)物(wu)壓(ya)住的狀(zhuang)態下，電化(hua)(hua)(hua)(hua)鋁(lv)(lv)受(shou)(shou)熱(re)(re)(re)使(shi)其上(shang)熱(re)(re)(re)熔(rong)性的有機(ji)硅樹脂層(ceng)(ceng)和膠牯劑熔(rong)化(hua)(hua)(hua)(hua)，此(ci)時受(shou)(shou)熱(re)(re)(re)熔(rong)化(hua)(hua)(hua)(hua)的有機(ji)硅樹脂粘(zhan)性變(bian)小，而(er)特種熱(re)(re)(re)敏膠粘(zhan)劑受(shou)(shou)熱(re)(re)(re)熔(rong)化(hua)(hua)(hua)(hua)后粘(zhan)性增加，使(shi)得鋁(lv)(lv)層(ceng)(ceng)與(yu)電化(hua)(hua)(hua)(hua)鋁(lv)(lv)基膜剝離的同時轉印(yin)到(dao)了承(cheng)印(yin)物(wu)上(shang)。隨著壓(ya)力的卸除，膠粘(zhan)劑迅速冷卻固化(hua)(hua)(hua)(hua)，鋁(lv)(lv)層(ceng)(ceng)牢(lao)固地附(fu)著在(zai)承(cheng)印(yin)物(wu)上(shang)，完成一個燙(tang)印(yin)過程(cheng)。