燙(tang)(tang)金基(ji)本工藝是在(zai)壓(ya)力狀(zhuang)(zhuang)態，即電(dian)(dian)(dian)化(hua)鋁被(bei)燙(tang)(tang)印(yin)版、承(cheng)(cheng)印(yin)物(wu)壓(ya)住的(de)狀(zhuang)(zhuang)態下(xia)，電(dian)(dian)(dian)化(hua)鋁受(shou)熱使(shi)其上(shang)(shang)熱熔(rong)性(xing)的(de)有機硅(gui)樹脂層和膠牯劑熔(rong)化(hua)，此(ci)時受(shou)熱熔(rong)化(hua)的(de)有機硅(gui)樹脂粘(zhan)性(xing)變小(xiao)，而特(te)種熱敏(min)膠粘(zhan)劑受(shou)熱熔(rong)化(hua)后(hou)粘(zhan)性(xing)增加(jia)，使(shi)得鋁層與電(dian)(dian)(dian)化(hua)鋁基(ji)膜剝(bo)離的(de)同時轉印(yin)到了承(cheng)(cheng)印(yin)物(wu)上(shang)(shang)。隨著(zhu)(zhu)壓(ya)力的(de)卸(xie)除，膠粘(zhan)劑迅速(su)冷卻固(gu)化(hua)，鋁層牢固(gu)地(di)附著(zhu)(zhu)在(zai)承(cheng)(cheng)印(yin)物(wu)上(shang)(shang)，完成一個燙(tang)(tang)印(yin)過程。