燙(tang)金基本工藝是在壓力(li)狀(zhuang)態，即電(dian)化(hua)(hua)鋁(lv)被燙(tang)印(yin)版、承印(yin)物壓住的(de)狀(zhuang)態下，電(dian)化(hua)(hua)鋁(lv)受熱(re)(re)(re)使其上熱(re)(re)(re)熔(rong)(rong)(rong)性的(de)有機(ji)硅樹脂(zhi)層和膠(jiao)(jiao)牯(gu)劑(ji)熔(rong)(rong)(rong)化(hua)(hua)，此時(shi)受熱(re)(re)(re)熔(rong)(rong)(rong)化(hua)(hua)的(de)有機(ji)硅樹脂(zhi)粘(zhan)性變小，而特種熱(re)(re)(re)敏膠(jiao)(jiao)粘(zhan)劑(ji)受熱(re)(re)(re)熔(rong)(rong)(rong)化(hua)(hua)后粘(zhan)性增加，使得鋁(lv)層與電(dian)化(hua)(hua)鋁(lv)基膜剝離的(de)同時(shi)轉印(yin)到了承印(yin)物上。隨著(zhu)(zhu)壓力(li)的(de)卸除，膠(jiao)(jiao)粘(zhan)劑(ji)迅速冷卻固化(hua)(hua)，鋁(lv)層牢固地附著(zhu)(zhu)在承印(yin)物上，完成一(yi)個燙(tang)印(yin)過程(cheng)。