燙(tang)金(jin)基本工藝是在壓力狀(zhuang)態，即電(dian)化(hua)(hua)鋁(lv)(lv)被燙(tang)印版、承印物(wu)壓住的(de)狀(zhuang)態下，電(dian)化(hua)(hua)鋁(lv)(lv)受(shou)熱(re)使其(qi)上(shang)(shang)熱(re)熔(rong)性的(de)有機(ji)硅樹脂層和(he)膠(jiao)牯(gu)劑(ji)熔(rong)化(hua)(hua)，此時(shi)受(shou)熱(re)熔(rong)化(hua)(hua)的(de)有機(ji)硅樹脂粘性變小，而(er)特種熱(re)敏膠(jiao)粘劑(ji)受(shou)熱(re)熔(rong)化(hua)(hua)后粘性增加，使得鋁(lv)(lv)層與電(dian)化(hua)(hua)鋁(lv)(lv)基膜剝(bo)離的(de)同時(shi)轉印到了承印物(wu)上(shang)(shang)。隨著(zhu)(zhu)壓力的(de)卸除，膠(jiao)粘劑(ji)迅速冷卻固化(hua)(hua)，鋁(lv)(lv)層牢固地(di)附著(zhu)(zhu)在承印物(wu)上(shang)(shang)，完(wan)成(cheng)一個燙(tang)印過(guo)程。