燙(tang)金基(ji)本工藝是在壓(ya)力(li)狀態，即電(dian)化鋁(lv)(lv)(lv)被燙(tang)印版、承印物(wu)壓(ya)住的狀態下，電(dian)化鋁(lv)(lv)(lv)受熱(re)使其(qi)上(shang)熱(re)熔(rong)性(xing)(xing)的有機硅樹脂(zhi)層(ceng)(ceng)和膠(jiao)牯劑熔(rong)化，此時受熱(re)熔(rong)化的有機硅樹脂(zhi)粘(zhan)(zhan)性(xing)(xing)變小(xiao)，而特(te)種(zhong)熱(re)敏膠(jiao)粘(zhan)(zhan)劑受熱(re)熔(rong)化后粘(zhan)(zhan)性(xing)(xing)增加，使得鋁(lv)(lv)(lv)層(ceng)(ceng)與(yu)電(dian)化鋁(lv)(lv)(lv)基(ji)膜剝離的同時轉印到(dao)了承印物(wu)上(shang)。隨(sui)著壓(ya)力(li)的卸除，膠(jiao)粘(zhan)(zhan)劑迅(xun)速冷卻固(gu)化，鋁(lv)(lv)(lv)層(ceng)(ceng)牢固(gu)地附(fu)著在承印物(wu)上(shang)，完成(cheng)一個燙(tang)印過程。