燙金基(ji)本工藝是在壓力狀態，即(ji)電(dian)(dian)化(hua)(hua)鋁(lv)被燙印(yin)版、承印(yin)物(wu)壓住的狀態下，電(dian)(dian)化(hua)(hua)鋁(lv)受熱(re)(re)使其上(shang)熱(re)(re)熔(rong)性(xing)的有(you)機(ji)硅樹脂層和膠(jiao)(jiao)牯劑(ji)(ji)熔(rong)化(hua)(hua)，此時(shi)受熱(re)(re)熔(rong)化(hua)(hua)的有(you)機(ji)硅樹脂粘(zhan)(zhan)性(xing)變小，而特種熱(re)(re)敏(min)膠(jiao)(jiao)粘(zhan)(zhan)劑(ji)(ji)受熱(re)(re)熔(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)增(zeng)加，使得鋁(lv)層與(yu)電(dian)(dian)化(hua)(hua)鋁(lv)基(ji)膜剝離的同(tong)時(shi)轉印(yin)到了承印(yin)物(wu)上(shang)。隨著壓力的卸除，膠(jiao)(jiao)粘(zhan)(zhan)劑(ji)(ji)迅速冷卻固化(hua)(hua)，鋁(lv)層牢固地附(fu)著在承印(yin)物(wu)上(shang)，完成一(yi)個燙印(yin)過程。