燙(tang)金基本(ben)工藝是在壓力狀(zhuang)態，即電(dian)化(hua)(hua)(hua)鋁被(bei)燙(tang)印(yin)版(ban)、承(cheng)印(yin)物壓住的(de)狀(zhuang)態下，電(dian)化(hua)(hua)(hua)鋁受熱使其上熱熔(rong)(rong)性(xing)的(de)有機硅(gui)樹(shu)(shu)脂(zhi)(zhi)層和膠(jiao)牯(gu)劑熔(rong)(rong)化(hua)(hua)(hua)，此(ci)時(shi)受熱熔(rong)(rong)化(hua)(hua)(hua)的(de)有機硅(gui)樹(shu)(shu)脂(zhi)(zhi)粘(zhan)(zhan)(zhan)性(xing)變(bian)小，而特(te)種熱敏膠(jiao)粘(zhan)(zhan)(zhan)劑受熱熔(rong)(rong)化(hua)(hua)(hua)后粘(zhan)(zhan)(zhan)性(xing)增加，使得鋁層與(yu)電(dian)化(hua)(hua)(hua)鋁基膜剝離(li)的(de)同時(shi)轉印(yin)到了承(cheng)印(yin)物上。隨著(zhu)壓力的(de)卸除(chu)，膠(jiao)粘(zhan)(zhan)(zhan)劑迅速冷(leng)卻固(gu)化(hua)(hua)(hua)，鋁層牢固(gu)地附著(zhu)在承(cheng)印(yin)物上，完(wan)成一個燙(tang)印(yin)過程。