燙(tang)金基(ji)本工藝是(shi)在壓力狀態，即電化(hua)(hua)鋁被燙(tang)印版、承(cheng)印物(wu)壓住(zhu)的(de)(de)狀態下(xia)，電化(hua)(hua)鋁受(shou)(shou)熱(re)(re)使其(qi)上熱(re)(re)熔(rong)(rong)(rong)性(xing)的(de)(de)有機(ji)(ji)硅(gui)樹脂(zhi)層(ceng)和(he)膠牯(gu)劑熔(rong)(rong)(rong)化(hua)(hua)，此時受(shou)(shou)熱(re)(re)熔(rong)(rong)(rong)化(hua)(hua)的(de)(de)有機(ji)(ji)硅(gui)樹脂(zhi)粘(zhan)性(xing)變小，而特種熱(re)(re)敏膠粘(zhan)劑受(shou)(shou)熱(re)(re)熔(rong)(rong)(rong)化(hua)(hua)后粘(zhan)性(xing)增加，使得(de)鋁層(ceng)與電化(hua)(hua)鋁基(ji)膜剝離的(de)(de)同時轉印到(dao)了承(cheng)印物(wu)上。隨著壓力的(de)(de)卸除，膠粘(zhan)劑迅速冷卻(que)固(gu)化(hua)(hua)，鋁層(ceng)牢固(gu)地附(fu)著在承(cheng)印物(wu)上，完成(cheng)一個(ge)燙(tang)印過程。