燙金(jin)基(ji)本工藝(yi)是在壓(ya)(ya)力狀(zhuang)態，即電化(hua)(hua)(hua)鋁被(bei)燙印版、承(cheng)(cheng)印物(wu)壓(ya)(ya)住(zhu)的狀(zhuang)態下，電化(hua)(hua)(hua)鋁受(shou)熱(re)使其上熱(re)熔(rong)性(xing)的有(you)機硅樹脂層(ceng)和(he)膠(jiao)牯劑熔(rong)化(hua)(hua)(hua)，此(ci)時受(shou)熱(re)熔(rong)化(hua)(hua)(hua)的有(you)機硅樹脂粘(zhan)(zhan)性(xing)變(bian)小(xiao)，而特種熱(re)敏膠(jiao)粘(zhan)(zhan)劑受(shou)熱(re)熔(rong)化(hua)(hua)(hua)后(hou)粘(zhan)(zhan)性(xing)增加，使得鋁層(ceng)與電化(hua)(hua)(hua)鋁基(ji)膜剝離的同時轉(zhuan)印到了承(cheng)(cheng)印物(wu)上。隨著壓(ya)(ya)力的卸除(chu)，膠(jiao)粘(zhan)(zhan)劑迅速冷卻固(gu)化(hua)(hua)(hua)，鋁層(ceng)牢固(gu)地(di)附(fu)著在承(cheng)(cheng)印物(wu)上，完成一個燙印過程。