燙金(jin)基(ji)本工藝是在壓力狀態(tai)(tai)，即(ji)電(dian)化(hua)鋁(lv)被(bei)燙印(yin)(yin)版、承(cheng)印(yin)(yin)物(wu)壓住的(de)狀態(tai)(tai)下，電(dian)化(hua)鋁(lv)受熱(re)(re)使(shi)其上(shang)(shang)熱(re)(re)熔(rong)(rong)(rong)性(xing)的(de)有機(ji)硅樹脂(zhi)層和膠(jiao)牯劑(ji)熔(rong)(rong)(rong)化(hua)，此時受熱(re)(re)熔(rong)(rong)(rong)化(hua)的(de)有機(ji)硅樹脂(zhi)粘(zhan)性(xing)變(bian)小，而特種熱(re)(re)敏(min)膠(jiao)粘(zhan)劑(ji)受熱(re)(re)熔(rong)(rong)(rong)化(hua)后粘(zhan)性(xing)增(zeng)加，使(shi)得鋁(lv)層與電(dian)化(hua)鋁(lv)基(ji)膜剝離(li)的(de)同(tong)時轉印(yin)(yin)到了承(cheng)印(yin)(yin)物(wu)上(shang)(shang)。隨著(zhu)壓力的(de)卸除，膠(jiao)粘(zhan)劑(ji)迅速冷卻固(gu)(gu)化(hua)，鋁(lv)層牢固(gu)(gu)地附著(zhu)在承(cheng)印(yin)(yin)物(wu)上(shang)(shang)，完成一(yi)個燙印(yin)(yin)過程(cheng)。