燙金基(ji)本工藝(yi)是在壓(ya)力狀(zhuang)態(tai)，即電化鋁被燙印版、承(cheng)(cheng)印物(wu)壓(ya)住的(de)狀(zhuang)態(tai)下(xia)，電化鋁受熱(re)使(shi)其上(shang)熱(re)熔(rong)(rong)性(xing)(xing)的(de)有機(ji)(ji)硅(gui)樹脂(zhi)層(ceng)和(he)膠(jiao)(jiao)牯(gu)劑(ji)(ji)熔(rong)(rong)化，此時(shi)受熱(re)熔(rong)(rong)化的(de)有機(ji)(ji)硅(gui)樹脂(zhi)粘(zhan)性(xing)(xing)變小，而特種熱(re)敏膠(jiao)(jiao)粘(zhan)劑(ji)(ji)受熱(re)熔(rong)(rong)化后粘(zhan)性(xing)(xing)增加(jia)，使(shi)得鋁層(ceng)與電化鋁基(ji)膜剝離的(de)同時(shi)轉印到了承(cheng)(cheng)印物(wu)上(shang)。隨著壓(ya)力的(de)卸(xie)除(chu)，膠(jiao)(jiao)粘(zhan)劑(ji)(ji)迅速冷卻固(gu)(gu)化，鋁層(ceng)牢固(gu)(gu)地附著在承(cheng)(cheng)印物(wu)上(shang)，完成一個(ge)燙印過程(cheng)。